Plenary Speakers

Professor Alexander Verl

Professor Chris Zhang

Professor Olaf Diegel

www.m2vip-conference.org

 

Call for Papers

Program Committee

Paper Submission

Registration

Plenary Talks

Final Program

Venue & Accommodation

Pure New Zealand

Special Sessions

 

 

 

Conference Chairs

Glen Bright

University of KwaZulu-Natal, South Africa

Xiangyang Zhu

Shanghai Jiaotong University, China

Fakhrul Alam

Massey University, New Zealand

 

Program Chairs

Tom Moir

AUT University, New Zealand

James Chang

National Tsinghua University, Taiwan

Zhisheng Zhang

Southeast University, China

Steven Dirven

Massey University, New Zealand

 

Organizing Chairs

Johan Potgieter

Massey University, New Zealand

XiaoQi Chen

University of Canterbury, New Zealand

Tom Qi

Otago Polytechnic, New Zealand

 

Publicity Chairs

Alexander Verl

University of Stuttgart, Germany

Toshiyuki Murakami

Keio University, Japan

Chris Zhang

University of Saskatchewan, Canada

Khalid Arif

Massey University, New Zealand

 

Steering Chairs

Peter Xu

The University of Auckland, New Zealand

John Billingsley

University of Southern Queensland, Australia

Peter Brett

Brunel University, UK

 

CALL FOR PAPERS

M2VIP-Conference has got into the third decade since its birth in 1994. Mechatronics is regarded as the fusion of mechanical, electrical and computer engineering for the design and development of mechatronic products while machine vision brings a sense of intelligence. With the advent of new functional materials, smart actuators, smart sensors, embedded computers and 3D printing technologies, as well as the latest advance in machine vision, intelligence, machine learning and computational modeling, a lot of more intelligent, powerful, miniaturized or user-friendly devices, systems and robots are emerging that meet the needs of modern day living and the challenges with Industry 4.0. At the core of these emerging smart products is essentially novel Mechatronic ways in coordinating the sensors that detect interactions with the surroundings and measure internal states, and commanding the actuators to achieve the motion functionalities, delivering the machine intelligence and manufacturing in 3D printing technologies. Research in Mechatronics and Machine Vision in Practice (M2VIP) is always active worldwide and M2VIP-Conference provides a forum for researchers, academics and students to exchange and present their latest results and best practices.

 

Topics

The topics covered in the conference will include, but not be limited to,

         Smart actuators, smart materials, and drive technologies

         Mechatronics in agriculture, food, and horticulture

         Manipulative, mobile, walking, flying, humanoid and biomimetic robots

         Artificial and computational intelligence

         Robotic rehabilitation systems

         Wearable assistive devices

         Surgical robots and mechatronics in medicine

         Intelligent aids for the elderly and disabled

         Real-time programming and intelligence

         Signal processing and embedded systems

         Intelligent control and automation

         Machine vision, image processing and pattern recognition

         Sensors, sensor fusion & sensor networks

         Remote assistance, VR and AR

         3D printing technologies and additive manufacturing

         Manufacturing automation, control and optimization

         Autonomous cars and electric car technologies

         Localization/SLAM for mechatronic and robotic systems

 

Publication

All the papers presented at the conference will be submitted to IEEE Xplore for consideration of publication.

 

Deadlines

Paper Submission: 1 August 2017 15 August 2017

Notification of Acceptance: 15 September 2017

Submission of Final Manuscripts: 1 October 2017

 

Conference Inquiry

Professor Tom Moir for paper submission, email: tom.moir@aut.ac.nz

Professor Johan Potgieter for registration, email: admin@m2vip-conference.ord

Organised by: The University of Auckland, AUT University and Massey University

Sponsored by: IEEE

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